ELECTRONIC MATERIALS & CONNECTORS

Analysis of individual electronic components, connectors and printed circuit boards by scanning electron and optical microscopy, including cross-sectional examination, can assist investigation of failures and potential areas of failure.

Cross sectioning and ultra-high magnification imaging with x-ray analysis of PCBs, connectors and components can reveal details including:

• composition and thickness of plating layers and interlayers,
• through hole plating/vias,
• contamination including lead,
• environmental factors such as chemical attack/corrosion,
• damage to contact faces and layers, including fretting/oxidation,
• cyclic failure/fatigue,
• fracture of solder joints.

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